SOLDER PALLET MATERIALS

Soldering pallet materials T301

TFUER-T301

T301 is a high-performance composite material specifically engineered for industrial and technical applications, including electronics, soldering, and assembly. Composed of fiberglass reinforcement and thermosetting resin, T301 is designed for use in demanding environments. It is commonly employed in a variety of applications, such as solder pallets, insulating boards, and heat-resistant surfaces in electronic manufacturing, due to its excellent durability, thermal stability, and resistance to mechanical stress.

Soldering pallet materials T315

TFUER-T315

T315 is a high-performance composite material widely used as a solder pallet in printed circuit board (PCB) manufacturing processes. It is composed of a blend of thermoset epoxy resin and glass fiber fabric, providing exceptional mechanical strength, thermal stability, and chemical resistance. These properties make T315 ideal for withstanding the demanding conditions of soldering and assembly in electronics manufacturing.

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