NEWS & EVENTS
High-Performance PCB Solder Pallet & Fixture Material
Our high-performance PCB Solder Pallet Material is engineered specifically for the fabrication of wave solder pallets and SMT reflow fixtures. It provides high-precision alignment for PCBs during the assembly process while acting as a robust thermal shield to protect sensitive components from extreme soldering temperatures.
Key Advantages
Versatile Application: Easily customized for SMT, wave soldering, reflow ovens, or universal assembly fixtures.
High-Efficiency Production: Supports multi-cavity designs, allowing multiple PCBs to be loaded simultaneously to maximize assembly line throughput.
Precision Alignment: Single-base registration accuracy supports multi-up panels and mirrored (top/bottom) panelization.
Stable Clamping: Integrated spring-clamp / elastic hook mechanisms ensure secure locking and minimize defects.
Warp Resistance: Designed for high-temperature reflow environments, keeping PCBs perfectly flat and preventing thermal deformation.
Technical Specifications (TDS)
| Specification Data Sheet | Unit | T301 | T301G | T303 |
|---|---|---|---|---|
| Grade | N/A | Thermal Anti-Statci | Optical Anti-Static | Optical Anti-Static |
| Color | N/A | Black | Grey | Black |
| Density | g/cm3 | 1.85 | 1.85 | 1.85 |
| Water Absorption | % | 0.2 | 0.2 | 0.2 |
| Flexural strength | MPA(23°C) | 320 | 320 | 350 |
| MPA(150°C) | 155 | 155 | 180 | |
| Flexural modulus of elasticity | MPA(23°C) | 18000 | 18000 | 19000 |
| MPA(150°C) | 8000 | 8000 | 9000 | |
| Coefficient of linear expansion | 10-6/K | 10 | 10 | 10 |
| Thermal conductivity | W/(m°K) | 0.21 | 0.21 | 0.2 |
| Transient working temperature | °C | 320 | 320 | 350 |
| Continuous working temperature | °C | 280 | 280 | 300 |
| Specific surface resistance | Ω | 105 ~ 109 | 105 ~ 109 | 105 ~ 109 |
| Thickness tolerance | mm | -0.10/+0.10 | -0.10/+0.10 | -0.10/+0.10 |
| Flatness tolerance (300x300mm) | mm | 0.20 | 0.20 | 0.20 |
| Chemical resistance | N/A | Excellent | Excellent | Excellent |
Applications
Wave Solder Pallets: Protects bottom-side components while exposing only targeted through-hole points to the solder wave.
Reflow Soldering Trays: Supports PCBs through reflow ovens, ensuring uniform and stable heat distribution.
Selective Soldering Fixtures: Delivers pinpoint soldering accuracy for specific components without thermal overflow to neighboring areas.
PCB Test Fixtures (ICT/FCT): Heavy-duty, stable substrate for post-soldering quality inspection and testing.
Engineering & Design Excellence
1. Outstanding Fine-Detail Machining
Unlike standard durostone or composite materials that fray or crack, this material maintains structural integrity even when machined into ultra-thin walls or thin-base pockets (down to 0.5 mm). This allows for highly complex, dense pallet designs without sacrificing durability.
2. Advanced Chemical Resistance
Electronics manufacturing involves harsh chemicals. This material resists aggressive flux residues and heavy-duty flux solvents, ensuring the pallet does not degrade or delaminate over time.
3. Maintenance-Free (PTFE/Teflon Uncoated)
Standard pallets often require regular Teflon coatings to prevent solder adhesion and ease cleaning. Our material is naturally solder-resistant and easy to clean without Teflon coatings, drastically reducing your maintenance downtime and overhead costs.
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